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Nichrome Resistor Networks
on Silicon Substrates
SFN08A, SFN08B Series
Package Power And Derating Curve
Model
SFN08
Environmental (MIL-R-8340 1)
Thermal Shock plus Power Conditioning
Short Time Overload
Terminal Strength
Moisture Resistance
Mechanical Shock
Vibration
Low Temperature Operation
High Temperature Exposure
Resistance to Solder Heat
Marking Permanency
Flammability
Storage Temperature Range
Mechanical
Pad Plating
Pad Material
Pad Coplanarity
Substrate Material
Resistor Material
Body Material
4 Maximum power per resistor @ 70C is 100 mW, not to exceed package power
General Note
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
Package Power @ 70°C(watts) 4
0.4
Δ R 0.25%
Δ R 0.1%
Δ R 0.1%
Δ R 0.2%
Δ R 0.25%
Δ R 0.25%
Δ R 0.05%
Δ R 0.1%
Δ R 0.1%
Per MIL-STD-202, Method 215
UL-94V-0 Rated
-55°C to +125°C
100 matte Tin (RoHS compliant)
Copper Alloy
0.003” (0.08 mm)
Silicon
Passivated Nichrome
Molded Epoxy
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
? TT electronics plc
01. 12
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